Leakster: the Dimensity 2000 will be made on the TSMC 4nm node, use Cortex-X2 and Mali-G710

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Last month a rumor claimed that MediaTek’s next generation of Dimensity flagship chipsets will use the new ARMv9 architecture. This tied in to previous rumors that MediaTek is one of the first to have placed orders with TSMC’s 4 nm foundries.

This chip is tentatively dubbed the Dimensity 2000 and leakster Digital Chat Station confirms the above and adds some details about its makeup.

It will feature one Cortex-X2 prime core running at 3.0 GHz, three Cortex-A710 cores and four A510 cores. This is basically the same setup as the Snapdragon 898 and the Exynos 2200 (though these two will be fabbed on Samsung’s 4 nm process instead).

The GPU is said to be a Mali-G710 MC10. With Samsung moving to an AMD GPU and Huawei having difficulties making new chips, this Dimensity may be the first (and for a while only) chipset to use the new G710.

The G710 is 20% faster than the G78 it replaces, according to ARM’s official numbers. Samsung is reportedly targeting a 30% boost over the old Mali with its AMD GPU. Anyway, the G710 also promises a 20% improvement in power efficiency and a 35% better performance for machine learning tasks.

Leakster: the Dimensity 2000 will be made on the TSMC 4nm node, will use Cortex-X2 and Mali-G710

For both the CPU and the GPU the performance will be dictated by the clock speeds that can be achieved on the two 4 nm nodes. The Exynos 2200 is also targeting 3.0 GHz, Qualcomm may be aiming slightly higher at 3.09 GHz, according to Ice Universe.

While we’ve seen some early benchmarks that allegedly ran on the Exynos, it’s too early to tell how the final product will perform. All three chips should be made official at the end of this year or in January. MediaTek was reportedly planning to launch the new Dimensity series by the end of 2021, but with the current plague on the semiconductor industry plans change often. Even so, the first ARMv9 phones with the new chipsets should be out early next year.

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